A Bespoke Solution to R2P NIL
Our bespoke solution requires less imprinting force in comparison to wafer moulding/Plate-to-Plate (P2P NIL) due to the smaller nip contact area (specific to Stensborg’s bespoke solution). A nip imprint approach reduces issues concerning trapped air bubbles and can have a built-in compensation for variation of material thickness, which improves replication uniformity.
Read more about the advantages of the R2P NIL process by downloading
the infographic below.